30ml Useful Heat Resistance No Drawing SMT Patch Adhensive Stencil Repair Red Glue for BGA SMD SMT IC

Brand new and high quality Curing Temperature: up and down heating temperature 150 degrees Curing Time: 95 seconds Capacity: 30ml Suitable for: BGA SMD SMT IC repair, etc Features: 1. No drawing, smearing and pollution phenomena appeared. 2. With strength adhesiveness to bonding variety of surface mount components . 3. Excellent storage stability and good heat resistance.

Notice: 1. The real color of the item may be slightly different from the pictures shown on the website caused by many factors such as brightness of your monitor and light brightness. 2. Please allow slight manual measurement deviation for the data. Thank for your understanding. 3. 1cm=0.39''.

Package Included: 1x 30ml Red Glue 1x Needle