100pcs Htsink 401w/mk Thermal Conductivity Burr Glossy Copper Material Small Htsink for Laptop GPU CPU

Improving Thermal Conductivity: The small htsink is used for thermal conductivity and aperture filling between the graphics card and the cooling module to improve thermal conductivity 401w/mk: The htsink has a thermal conductivity of up to 401w/mk, providing powerful cooling for your equipment Copper Material: The small htsink is made of copper, which is wr resistant and , and has a service life Item Type: Htsink Material: Copper Thermal Conductivity: 401w/mk