BGA Reballing Station Solder Rework Kit Soldering Station Stencils Balls Kit

Features: Aluminum alloy structure, the structure is light and durable. The upper cover has a groove which is convenient for removal of excess tin balls. One reballing station can be used with different stencils. Can correspond to BGA of different sizes, maximum chip size is 50*50mm. BGA chip secedes steel stencils size is 90*90mm. Specifications: Material: Aluminum alloy Tin Balls Size: 0.76mm, 0.6mm, 0.5mm, 0.45mm Weight: 635g(approx.) Package Includes: 1 x BGA Reballing Station with Handles(90*90mm) 9 x Steel Stencils 4 Bottles x Tin Balls (0.76mm, 0.6mm, 0.5mm, 0.45mm) 1 x Desoldering Wick 1 x Brush 1 x Tap 1 x Tn Shaving Pen 1 x Hex Key .