Arc Pad Curved Universal BGA Stencil Tin Planting Insulation Base Silicone Motherboard IC Chip BGA Stencil Planting Pad

Features: Enhance your soldering quality with our Curved Solder Pads, designed for efficient heat conduction and suitable for various electronic component installations. Featuring a unique curved design for strong adhesion, these pads are made from high temperature resistant silicone, ensuring durability and easy customization through cutting and resizing. Ideal for electronics engineers, DIY enthusiasts, repair technicians, and electronic product manufacturers seeking reliable soldering solutions. Perfectly suited for circuit board soldering, electronic device assembly, and repair in both professional and hobbyist settings. Experience seamless integration into your projects with these versatile solder pads, enhancing precision and performance in every application.

Specifications: Material: Silicone Size: About. 10x8cm/3.94x3.14in

Note: Please allow 1-2cm errors due to manual measurement. Due to difference between different monitors, the picture may not reflect the item actual color.

Package includes: 1pc Arc Pad